The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Oct. 18, 2022
SK Hynix Inc., Icheon, KR;
Iucf-hyu (Industry-university Cooperation Foundation Hanyang University), Seoul, KR;
Cheolmin Shin, Seoul, KR;
Hyun Goo Kang, Seoul, KR;
Jong Young Cho, Hanam, KR;
Ungyu Paik, Seoul, KR;
Taeseup Song, Seoul, KR;
Dong Hyeok Kim, Seoul, KR;
SK hynix Inc., Icheon, KR;
IUCF-HYU (Industry-University Cooperation Foundation Hanyang University), Seoul, KR;
Abstract
A CMP slurry composition for polishing a boron silicon (B—Si) compound may include a catalyst, an abrasive including a plurality of particles and being configured to polish the boron silicon (B—Si) compound, and a pH adjuster. The CMP slurry composition may further include an oxidizer. The catalyst may have a binary catalyst configuration comprising a first catalyst material and a second catalyst material. The first catalyst material may include Fe, and the second catalyst material may include Cu. The oxidizer may include hydrogen peroxide (HO). A CMP (chemical mechanical polishing) method for a boron silicon (B—Si) compound may include providing a substrate structure including a thin film formed of the boron silicon (B—Si) compound and performing a CMP process on the thin film. The CMP process is performed by using the CMP slurry composition.