The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

May. 31, 2022
Applicant:

Spirit Aerosystems, Inc., Wichita, KS (US);

Inventor:

Mark Anthony Wadsworth, Wichita, KS (US);

Assignee:

Spirit AeroSystems, Inc., Wichita, KS (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/34 (2006.01); B29C 70/54 (2006.01); B33Y 80/00 (2015.01); B29K 101/12 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 70/342 (2013.01); B29C 70/544 (2021.05); B33Y 80/00 (2014.12); B29K 2101/12 (2013.01); B29K 2905/00 (2013.01); B29L 2031/3082 (2013.01);
Abstract

A method for fusing thermoplastic composite structures includes placing a thermoplastic substructure on an inner surface of a skin that is laid up on a shaping surface of a tool configured to maintain the shape of an outer mold line. The method further includes applying at least one metal layer over the substructure and applying an insulation layer over edge portions of the substructure and over exposed portions of the inner surface of the skin not in contact with the substructure and applying a vacuum bag that at least partly encloses the skin, the substructure, and the metal layer. The method yet still further includes applying heat to the shaping surface to fuse the substructure to the skin such that the skin exceeds its melting point and at least a portion of a raised segment of the substructure does not exceed its melting point.


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