The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 30, 2025

Filed:

Mar. 18, 2020
Applicant:

Futamura Kagaku Kabushiki Kaisha, Nagoya, JP;

Inventors:

Takuzo Imaizumi, Aichi, JP;

Naomi Goto, Aichi, JP;

Naoki Shiba, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 59/02 (2006.01); B29C 43/06 (2006.01); B29C 43/36 (2006.01); B29C 59/00 (2006.01); B29C 59/04 (2006.01); B32B 37/00 (2006.01); B32B 37/10 (2006.01);
U.S. Cl.
CPC ...
B29C 59/026 (2013.01); B29C 43/06 (2013.01); B29C 43/3697 (2013.01); B29C 59/002 (2013.01); B29C 59/04 (2013.01); B32B 37/0053 (2013.01); B32B 37/10 (2013.01);
Abstract

A device for the production of a thin plate laminate includes a setting device for creating a mold retention structure in which the molds are arranged on both surface sides of the workpiece, a heating device for heating the molds, a compression roller device in which the mold retention structure is introduced between two compression rollers and which compresses outer surfaces of the molds by rotating the compression rollers to integrally thermocompression-bond film resin composition and the substrate to form a thin plate laminate having the film resin layer, and an extraction device for extracting the mold retention structure after compression from the molds.


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