The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Mar. 01, 2022
Applicant:
Dowa Electronics Materials Co., Ltd., Tokyo, JP;
Inventor:
Takuya Kojima, Saitama, JP;
Assignee:
DOWA ELECTRONICS MATERIALS CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/068 (2022.01); B22F 1/05 (2022.01); B22F 9/04 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
B22F 1/068 (2022.01); B22F 1/05 (2022.01); B22F 9/04 (2013.01); H01B 1/22 (2013.01); B22F 2009/042 (2013.01); B22F 2009/045 (2013.01); B22F 2301/255 (2013.01); B22F 2304/10 (2013.01);
Abstract
To provide a flaky silver powder having a tapped density of from 0.8 g/mL to 1.9 g/mL, and a cumulative 50th percentile particle diameter (D) of from 2 μm to 7 μm, where the cumulative 50th percentile particle diameter (D) is measured by laser diffraction or laser scattering particle size analysis.
Kojima, Takuya. (2025). Silver flake powder and production method thereof, and electrically conductive paste (U.S. Patent No. 12427570). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12427570
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile