The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 30, 2025
Filed:
Apr. 15, 2021
Applicant:
Cummins Filtration Ip, Inc., Columbus, IN (US);
Inventors:
William C. Haberkamp, Cookville, TN (US);
Kan Wang, Peachtree City, GA (US);
Assignee:
Cummins Filtration IP, Inc., Columbus, IN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 39/16 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01); B32B 7/12 (2006.01); B32B 37/12 (2006.01); B32B 37/24 (2006.01); C09J 167/02 (2006.01); C09J 175/04 (2006.01); D04H 1/55 (2012.01); D04H 1/551 (2012.01); D04H 1/58 (2012.01); D04H 1/587 (2012.01); D04H 3/011 (2012.01); D04H 3/12 (2006.01);
U.S. Cl.
CPC ...
B01D 39/163 (2013.01); B32B 5/022 (2013.01); B32B 5/268 (2021.05); B32B 7/12 (2013.01); B32B 37/1207 (2013.01); B32B 37/1284 (2013.01); B32B 37/24 (2013.01); C09J 167/02 (2013.01); C09J 175/04 (2013.01); D04H 1/55 (2013.01); D04H 1/551 (2013.01); D04H 1/587 (2013.01); D04H 3/011 (2013.01); D04H 3/12 (2013.01); B01D 2239/0618 (2013.01); B01D 2239/0622 (2013.01); B01D 2239/0668 (2013.01); B01D 2239/083 (2013.01); B01D 2239/10 (2013.01); B32B 2037/123 (2013.01); B32B 2250/03 (2013.01); B32B 2250/20 (2013.01); B32B 2262/0284 (2013.01); B32B 2262/0292 (2013.01); B32B 2305/28 (2013.01); B32B 2367/00 (2013.01); B32B 2375/00 (2013.01);
Abstract
Embodiments described herein relate generally to adhesive alloys and their use in filter media, and in particular to adhesive alloys that can be melt blown onto a filter media layer, and which are thermally activated to bond the filter media layer to another filter media layer. An adhesive alloy is provided. A thermally activated adhesive has a first melting temperature. A polymer has a second melting temperature greater than the first melting temperature. A ratio of the thermally activated adhesive in the adhesive alloy is in a range of 5 wt % to 70 wt %.