The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
May. 04, 2022
Hamamatsu Photonics K.k., Hamamatsu, JP;
Daiki Suzuki, Hamamatsu, JP;
Takuma Osaki, Hamamatsu, JP;
Makoto Nozaki, Hamamatsu, JP;
Kota Sugizaki, Hamamatsu, JP;
HAMAMATSU PHOTONICS K.K., Hamamatsu, JP;
Abstract
A metal substrate supported by a wiring substrate includes a first extending portion and a first connection portion connected to the first extending portion. The first connection portion includes a first region facing a portion of a wiring substrate in a Z-axis direction, a second region being continuous from the first region, and a third region being continuous from the second region. When viewed in the Z-axis direction, in a direction perpendicular to a connection direction in which the third region is connected to the second region, a width of the second region is larger than a width of the third region. A first bonding member bonding the wiring substrate and the metal substrate includes a first portion disposed between the portion and the first region, and a second portion being continuous from the first portion. The second portion reaches the second region but does not reach the third region.