The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Dec. 20, 2022
Qingdao University of Technology, Shandong, CN;
Jianlin Luo, Qingdao, CN;
Xiaoyang Zhou, Qingdao, CN;
Huarong Nie, Qingdao, CN;
Yibo Gao, Qingdao, CN;
Zhiqing Li, Qingdao, CN;
Min Zhu, Qingdao, CN;
QINGDAO UNIVERSITY OF TECHNOLOGY, Qingdao, CN;
Abstract
A method for preparing a static/dynamic three-dimensional (3D) microcrack propagation sensor, a sensor and equipment, belongs to the field of sensor technology. The preparation method includes: preparing a piezoresistive/piezoelectric sensing functional component dispersed material, and then coating the dispersed material to the surface of a fiber cloth substrate to obtain a piezoresistive/piezoelectric sensing fiber cloth; performing a pre-stretching treatment on the piezoresistive/piezoelectric sensing fiber cloth to obtain a piezoresistive/piezoelectric sensing 3D microcrack fiber cloth; ablating the piezoresistive/piezoelectric sensing 3D microcrack fiber cloth by microwave to remove the fiber cloth substrate, then obtaining a piezoresistive/piezoelectric sensing 3D microcrack functional skeleton; coating a conductive layer on both surfaces of the piezoresistive/piezoelectric sensing 3D microcrack functional skeleton, thereby forming an electrode; polarizing the piezoresistive/piezoelectric sensing 3D microcrack functional skeleton with the formed electrodes on the surfaces; and, encapsulating the piezoresistive/piezoelectric sensing 3D microcrack functional skeleton to obtain a static/dynamic 3D microcrack propagation sensor.