The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Apr. 22, 2022
Applicant:

Tcl China Star Optoelectronics Technology Co., Ltd., Shenzhen, CN;

Inventors:

Bin Zhao, Shenzhen, CN;

Juncheng Xiao, Shenzhen, CN;

Xiaodan Lin, Shenzhen, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); H10H 20/857 (2025.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H10D 86/443 (2025.01); H10D 86/60 (2025.01); H10H 20/032 (2025.01); H10H 20/0364 (2025.01);
Abstract

The present application provides a manufacturing method of an array substrate, an array substrate, and a display panel. The manufacturing method of the array substrate includes providing a base substrate; forming a conductive layer and a photoresist layer on the base substrate; patterning the photoresist layer and the conductive layer to form a conductive area and an electroplating area electrically connected to each other; removing the photoresist layer; forming an electroplating layer; and disconnecting the electroplating area from the conductive area. In the present application, the photoresist layer has a less thickness to reduce manufacturing costs of the array substrate.


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