The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Jun. 09, 2021
Shenzhen Jufei Optoelectronics Co., Ltd., Shenzhen, CN;
Naoyuki Urasaki, Chikusei, JP;
Kanako Yuasa, Saitama, JP;
Shenzhen Jufei Optoelectronics Co., Ltd., Shenzhen, CN;
Abstract
A method of manufacturing an optical semiconductor device includes disposing an optical semiconductor element on a recessed part of an optical semiconductor element mounting package. The package includes at least two lead electrodes and a thermosetting epoxy resin composition. The lead electrodes are disposed opposite to and spaced apart from each other. Each lead electrode has a top surface, a bottom surface, and a side wall. The lead electrodes are not bent. The thermosetting epoxy resin composition forms a molded part disposed on at least a portion of the top surfaces of the lead electrodes and disposed at a region between the lead electrodes. The molded part together with a portion of each of the lead electrodes form a recessed part for disposing at least an optical semiconductor element. At least one of the side walls of the lead electrodes is not a straight line.