The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

May. 22, 2023
Applicant:

Roots Co., Ltd., Incheon, KR;

Inventors:

Sung Yoon Lee, Incheon, KR;

Soon Min Kim, Incheon, KR;

Jong Woo Ha, Seoul, KR;

Assignee:

ROOTS Co., Ltd., Incheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/01 (2025.01); H10H 20/851 (2025.01); H10H 29/01 (2025.01); H10H 29/851 (2025.01); B26D 11/00 (2006.01);
U.S. Cl.
CPC ...
H10H 20/0361 (2025.01); H10H 20/8514 (2025.01); H10H 29/0361 (2025.01); H10H 29/8514 (2025.01); B26D 2011/005 (2013.01); H10H 20/851 (2025.01);
Abstract

A method of manufacturing a fluorescent substance includes forming dicing trenches on one surface of a fluorescent substance wafer along lattice-shaped dicing lines, and a lower surface grinding operation (S) of grinding a surface opposite to a surface of the wafer in which the dicing trenches are formed as much as a predetermined thickness using a disk-shaped grinder so that the wafer is divided into a plurality of fluorescent substances, which are color conversion members for light emitting diodes (LEDs).


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