The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
May. 29, 2019
Ningbo Sunny Opotech Co., Ltd., Yuyao, CN;
NINGBO SUNNY OPOTECH CO., LTD., Yuyao, CN;
Abstract
The present application provides a photosensitive assembly, comprising: a photosensitive chip, having a first surface and a second surface facing away from the first surface, the first surface having a photosensitive region; an electronic element arranged around the photosensitive chip; a molded portion formed by a molding process and packaging the electronic element and the photosensitive chip together, the molded portion having a third surface flush with the first surface; and a first re-wiring layer formed on a non-photosensitive region of the first surface and on the third surface, a pad of the photosensitive chip being electrically connected to the electronic element through the first re-wiring layer, wherein a side surface or a bottom surface of the photosensitive assembly has a conductive region, and the conductive region is electrically connected to the first re-wiring layer. The present application further provides a corresponding manufacturing method of photosensitive assembly. The present application can reduce design limitations of the photosensitive assembly; and make camera modules in mobile terminals more modularized and easy to replace.