The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Dec. 30, 2022
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyeran Lee, Suwon-si, KR;

Junhyeok Ahn, Suwon-si, KR;

Kiseok Lee, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01); H01L 23/528 (2006.01); H10D 64/27 (2025.01);
U.S. Cl.
CPC ...
H10B 12/488 (2023.02); H01L 23/5283 (2013.01); H10B 12/482 (2023.02); H10D 64/513 (2025.01);
Abstract

An integrated circuit device includes a substrate comprising an active region and a word line trench, a word line extending longitudinally in a first horizontal direction in the word line trench, a buried insulating layer on the word line, a conductive plug on the substrate, and a pad structure on the substrate and having a portion in contact with a top surface of the active region and a portion in contact with the conductive plug. The pad structure includes a conductive pad having a bottom surface in contact with the top surface of the active region and a pad spacer in contact with a sidewall of the conductive pad and protruding beyond an inner sidewall of the word line trench in a second horizontal direction orthogonal to the first horizontal direction such that the pad spacer vertically overlaps a portion of the word line in the word line trench.


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