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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12426161 B1

PDFFull Text
Date of Patent:
Sep. 23, 2025

Filed:

Jun. 22, 2023

Printed circuit film, display device, and method of fabricating printed circuit film

Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Dong Hyun Lee, Anyang-si, KR;

Seung Soo Ryu, Hwaseong-si, KR;

Sang Hyuck Yoon, Seoul, KR;

Assignee:

SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do, KR;

Attorney:

CANTOR COLBURN LLP

Primary Examiner:

Julio J Maldonado

Assistant Examiner:

Stanetta D Isaac

Int. Cl.
CPC ...
H05K 1/11 (2006.01); G02F 1/1345 (2006.01); G09G 3/3275 (2016.01); H01L 23/00 (2006.01); H01L 25/18 (2023.01); H05K 1/18 (2006.01); H05K 3/22 (2006.01); H05K 3/34 (2006.01); H10K 59/131 (2023.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); G02F 1/13452 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 25/18 (2013.01); H05K 1/189 (2013.01); H05K 3/22 (2013.01); H05K 3/3442 (2013.01); G09G 3/3275 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83047 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83905 (2013.01); H05K 2201/056 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10136 (2013.01); H10K 59/131 (2023.02);
Abstract

A method of fabricating a printed circuit film including the steps of preparing a base film, and a plurality of lead wires disposed on the base film, the plurality of lead wires spaced apart from each other in a first direction and extending in a second direction intersecting the first direction, and forming a bonding member including a conductive member disposed to overlap a central portion of each of the plurality of lead wires, a first non-conductive member disposed to overlap a first portion of the plurality of lead wires in the second direction, and a second non-conductive member disposed to overlap a second portion of the plurality of lead wires in the second direction.

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