The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Feb. 10, 2021
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Takafumi Sugiyama, Yoshinogawa, JP;

Kaname Saito, Anan, JP;

Takashi Namie, Anan, JP;

Takuya Suzuki, Naruto, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02315 (2021.01); H01S 5/00 (2006.01); H01S 5/02255 (2021.01); H01S 5/0239 (2021.01); H01S 5/024 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02315 (2021.01); H01S 5/0087 (2021.01); H01S 5/02255 (2021.01); H01S 5/0239 (2021.01); H01S 5/02476 (2013.01);
Abstract

A light emission module includes a first light emission unit that includes a first light emission device and emits first light. The first light emission device includes a plurality of first light emission portions, each including a light emission surface, where light from a plurality of first light emission elements is emitted, a heat dissipation surface provided opposite to the light emission surface, and a connection portion being positioned between the light emission surface and the heat dissipation surface and including a wiring mounting surface where the light emission elements are electrically connected. The light emission module further includes a first optical member that reflects the first light, a housing including a base member where the first light emission unit and the first optical member are disposed and a lid member surrounding the light emission device surrounding the first light emission unit and the first optical member that are disposed on the base member, and a heat sink being connected to the heat dissipation surface and including a mounting surface where the first light emission device is mounted. The wiring mounting surface extends upward upper than a first upper surface of the housing, and a portion of the wiring mounting surface is exposed to the outside of the housing.


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