The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Jul. 08, 2022
Applicant:

Agc Automotive Americas Co., Alpharetta, GA (US);

Inventors:

Christopher A. Imeson, Lasalle, CA;

Joel Smith, Battle Creek, MI (US);

Marina Lynn Gearhart, Redford, MI (US);

Jiangping Wang, Novi, MI (US);

Timothy D. Peck, White Lake, MI (US);

Assignee:

AGC Automotive Americas Co., Alpharetta, GA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 43/027 (2006.01); B32B 17/10 (2006.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); C03C 27/10 (2006.01); H01R 4/04 (2006.01);
U.S. Cl.
CPC ...
H01R 43/027 (2013.01); B32B 17/10385 (2013.01); B32B 17/10761 (2013.01); B32B 37/1207 (2013.01); B32B 38/145 (2013.01); C03C 27/10 (2013.01); H01R 4/04 (2013.01); B32B 2037/1253 (2013.01); B32B 2307/202 (2013.01); B32B 2315/08 (2013.01); B32B 2605/006 (2013.01); H01R 2201/26 (2013.01);
Abstract

A method of manufacturing a window assembly having a solderless electrical connector includes forming a curved transparent substrate and applying a conductive ink having a thermal degradation temperature onto a surface of the curved transparent substrate. The method further includes applying an adhesive onto the surface of the curved transparent substrate adjacent to the conductive ink and optionally onto the applied conductive ink, and curing the adhesive at a temperature below the thermal degradation temperature of the conductive ink to form the solderless electrical connector with the solderless electrical connector being in electrical contact with the applied conductive ink.


Find Patent Forward Citations

Loading…