The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Jul. 19, 2022
Applicant:

Dell Products L.p., Round Rock, TX (US);

Inventors:

Steven Michael Christensen, Austin, TX (US);

Jonathan C. Giffen, Austin, TX (US);

Assignee:

Dell Products L.P., Round Rock, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/72 (2011.01); H01R 12/70 (2011.01); H01R 12/73 (2011.01);
U.S. Cl.
CPC ...
H01R 12/721 (2013.01); H01R 12/7047 (2013.01); H01R 12/737 (2013.01);
Abstract

An apparatus is provided for mounting a compression attached memory module (CAMM) to a printed circuit board (PCB). The apparatus includes the CAMM, a fastener and a z-axis compression connector. The CAMM includes a mounting through-hole. The fastener includes a friction snap with a first diameter. The compression connector includes a profiled mounting through-hole. The profiled mounting through-hole has a narrowest portion having a second diameter that is less than the first diameter. When the fastener is inserted through the mounting through-hole and the profiled mounting through-hole, and when the friction snap comes into contact with the narrowest portion, the friction snap is pushed through the narrowest portion, and, after pushing the friction snap through the narrowest portion, the CAMM, the compression connector, and the fastener are aligned and retained as a unit.


Find Patent Forward Citations

Quick Actions:

Christensen, Steven. (2025). Method for pre-assembly of compression attached memory modules (U.S. Patent No. 12424777). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12424777

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…