The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Apr. 29, 2022
Applicants:

Beijing Boe Sensor Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zhe Chen, Beijing, CN;

Yunnan Jin, Beijing, CN;

Zhifeng Zhang, Beijing, CN;

Guohui Nan, Beijing, CN;

Chunnan Feng, Beijing, CN;

Sihui Bao, Beijing, CN;

Shuo Yang, Beijing, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 13/10 (2006.01); H01Q 21/08 (2006.01); H01Q 21/24 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0414 (2013.01); H01Q 13/106 (2013.01); H01Q 21/08 (2013.01); H01Q 21/24 (2013.01); H05K 1/0298 (2013.01); H05K 2201/0145 (2013.01);
Abstract

An antenna and an electronic device are provided and belong to communication technology. The antenna includes an antenna substrate and a flexible circuit board. The antenna substrate includes: a first dielectric substrate, a first conductive layer on the first dielectric substrate and including at least one first feed line and at least one second feed line; a second conductive layer on a side of the first dielectric substrate away from the first conductive layer and including at least one first opening. The flexible circuit board includes: a second dielectric substrate and a third dielectric substrate opposite to each other; a third conductive layer between the second dielectric substrate and the third dielectric substrate; a first feed structure on a side of the second dielectric substrate away from the third conductive layer; each second feed port of the first feed structure being electrically connected to a corresponding first feed line.


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