The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Apr. 09, 2021
Applicant:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 21/00 (2006.01); H01Q 21/28 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0407 (2013.01); H01Q 21/0093 (2013.01); H01Q 21/28 (2013.01);
Abstract
A wiring board () includes a substrate () and a mesh wiring layer () disposed on the substrate () and including a plurality of wiring lines (). The substrate () has a transmittance of 85% or more for light with a wavelength of 380 nm or more and 750 nm or less. Each of the wiring lines () includes a metal layer () and a blackened layer () disposed on the metal layer (). The blackened layer () has a thickness (T) of 5 nm or more and 100 nm or less.