The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Jan. 10, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Min Young Yoon, Osan-si, KR;

Young Ki Lee, Suwon-si, KR;

Kyeol Kwon, Hwaseong-si, KR;

Dong Kwon Choi, Suwon-si, KR;

Doo Seok Choi, Suwon-si, KR;

Joon Hoi Hur, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 21/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 21/0025 (2013.01);
Abstract

An electronic device is provided. An electronic device includes a radio frequency integrated circuit (RFIC) chip, and an antenna array electrically connected to the RFIC chip, the antenna array including a first face and a second face facing each other in a first direction, and a third face and a fourth face connecting the first and second faces to each other and facing each other in a second direction intersecting the first direction, the antenna array including a plurality of substrates sequentially stacked in a third direction intersecting a plane defined by the first and second directions, first and second antenna modules on the plurality of substrates and sequentially arranged along the first direction, a first metal partition-wall including at least one metal via extending through the plurality of substrates in the third direction, and a second metal partition-wall surrounding the first to fourth faces.


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