The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Mar. 17, 2022
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventor:

Akira Haraguchi, Yokkaichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 25/18 (2023.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H05K 1/18 (2013.01); H05K 7/20418 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10174 (2013.01); H05K 2201/10272 (2013.01); H05K 2201/10522 (2013.01);
Abstract

A first heat dissipation member is thermally connected to a first busbar. A second heat dissipation member is thermally connected to a second busbar. The first busbar and the second busbar respectively have a first facing part and a second facing part that face each other. The first facing part has a first surface on which a first electronic component is mounted and a second surface opposite to the first surface. The second facing part has a third surface that faces the second surface and a fourth surface that is positioned opposite to the third surface and on which a second electronic component is mounted. A circuit board has a wiring board that is positioned behind the first facing part and is positioned in front of the second facing part when the second facing part side is seen from the first facing part side.


Find Patent Forward Citations

Loading…