The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Sep. 22, 2022
Applicant:

Playnitride Display Co., Ltd., MiaoLi County, TW;

Inventor:

Yen-Mu Chen, MiaoLi County, TW;

Assignee:

PlayNitride Display Co., Ltd., MiaoLi County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); B23K 1/005 (2006.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); B23K 26/351 (2014.01); B23K 101/36 (2006.01); H01L 21/66 (2006.01); H01L 25/065 (2023.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 24/98 (2013.01); B23K 1/0056 (2013.01); B23K 26/0608 (2013.01); B23K 26/0622 (2015.10); B23K 26/351 (2015.10); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/799 (2013.01); H01L 24/81 (2013.01); H01L 25/0655 (2013.01); H01L 25/0753 (2013.01); B23K 2101/36 (2018.08); H01L 22/22 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/7999 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/98 (2013.01);
Abstract

A method for trimming a micro electronic element includes: providing a substrate, wherein at least one micro electronic element is disposed on the substrate, heating an interface of the substrate and the micro electronic element by a first pulse laser beam to reduce a bonding force between the micro electronic element and the substrate, and irradiating a surface layer of the micro electronic element by a second pulse laser beam to generate a shock wave due to plasma on the surface layer of the micro electronic element. The shock wave removes the micro electronic element away from the substrate. An apparatus for trimming a micro electronic element is also provided.


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