The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Jun. 30, 2022
Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventor:

Akio Yamano, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/373 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); H01L 23/3735 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01);
Abstract

A semiconductor module includes a laminated substrate including an insulating board and a plurality of circuit boards that are arranged on an upper face of the insulating board, the plurality of circuit boards including first and second circuit boards, a semiconductor element disposed on the first circuit board and including, on an upper face of the semiconductor element, a main electrode, a gate pad, and a gate runner electrically connected to the gate pad, and a first wiring member electrically connecting the main electrode to the second circuit board. The gate runner extends so as to divide the main electrode into a plurality of electrodes including a first main electrode at a first side and a second main electrode at a second side, and the first wiring member is arranged to cross over the gate runner.


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