The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Dec. 20, 2021
Applicant:
Niterra Co., Ltd., Nagoya, JP;
Inventor:
Kensuke Matsuhashi, Nagoya, JP;
Assignee:
NITERRA CO., LTD., Nagoya, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/13 (2013.01); H01L 23/142 (2013.01); H01L 23/15 (2013.01); H05K 1/11 (2013.01); H05K 2201/09227 (2013.01);
Abstract
A wiring substrate includes a first ceramic layer and a second ceramic layer. A plurality of wiring traces which are electrically independent of one another are provided between the first ceramic layer and the second ceramic layer. Each wiring trace has a protruding portion which protrudes onto the first ceramic layer surrounded by the second ceramic layer when viewed from above. An insulating coat is provided to cover a portion of a concave corner formed by the second ceramic layer and the first ceramic layer.