The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Apr. 19, 2023
Dr. Ing. H.c. F. Porsche Aktiengesellschaft, Stuttgart, DE;
Maximilian Barkow, Stuttgart, DE;
Patrick Fuchs, Leonberg, DE;
Timijan Velic, Weissach, DE;
Bernd Eckardt, Erlangen, DE;
Maximilian Hofmann, Erlangen, DE;
Hubert Rauh, Erlangen, DE;
Andre Mueller, Erlangen, DE;
Benjamin Bayer, Erlangen, DE;
Jordan Sorge, Erlangen, DE;
DR. ING. H.C. F. PORSCHE AKTIENGESELLSCHAFT, Stuttgart, DE;
Abstract
A power semiconductor module includes a first and second insulating substrate, which is arranged parallel to and at a distance from the first insulating substrate. The first insulating substrate and the second insulating substrate each include an insulating layer, an inner metallization layer, and an outer metallization layer. The power semiconductor module also includes a first cooling device, which is arranged thermally conductively on the outer metallization layer of the first insulating substrate, a second cooling device, which is arranged thermally conductively on the outer metallization layer of the second insulating substrate. The power semiconductor module also includes a power semiconductor, arranged between the first insulating substrate and the second insulating substrate. At least one of the two insulating substrates include a through-contact, by which the inner metallization layer of the corresponding insulating substrate is electrically connected to the outer metallization layer of the corresponding insulating substrate.