The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
May. 18, 2022
Fuji Electric Co., Ltd., Kanagawa, JP;
Yuta Tamai, Matsumoto, JP;
Takahiro Koyama, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kanagawa, JP;
Abstract
A cooling apparatus for a semiconductor module including a semiconductor chip includes a top plate having a lower surface a bottom plate disposed to have a refrigerant circulation portion between the bottom plate and the lower surface of the top plate and a side wall configured to surround the refrigerant circulation portion. The side wall includes a fixed portion fixed to the top plate or the bottom plate with a fixing material. The fixed portion includes an edge portion disposed to face the top plate or the bottom plate and a separated portion disposed to be adjacent to the edge portion in a first direction in which the refrigerant circulation portion and the side wall are aligned, the separated portion being disposed farther from the top plate or the bottom plate disposed to face the edge portion than the edge portion.