The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Mar. 17, 2022
Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Takahiro Hirano, Kariya, JP;

Shun Sugiura, Kariya, JP;

Masanori Ooshima, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3142 (2013.01); H01L 23/48 (2013.01);
Abstract

A semiconductor device includes a semiconductor element, a sealing body, and a plurality of terminals. The sealing body seals the semiconductor element therein. The terminals are electrically connected to the semiconductor element inside of the sealing body, and project from the sealing body. Each of the terminals has a rough surface area having a larger surface roughness than a peripheral area in a section in a longitudinal direction of the terminal.


Find Patent Forward Citations

Hirano, Takahiro. (2025). Semiconductor device (U.S. Patent No. 12424503). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12424503

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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