The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Jan. 22, 2021
Mitsubishi Electric Corporation, Tokyo, JP;
Katsuhiko Kondo, Tokyo, JP;
Taishi Sasaki, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A semiconductor device according to the first disclosure includes a base plate that has an upper surface and a back surface on a side opposite the upper surface and at the back surface of which an annular groove is formed, a substrate provided on the upper surface of the base plate and a semiconductor chip provided on an upper surface of the substrate, wherein the base plate has a convex warping part that warps in a convex shape toward the upper surface side, and a part of the groove, which is formed at the convex warping part is deeper at a position farther away from a maximum warping part having a largest warp in the convex warping part.