The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Feb. 21, 2024
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Arvinder Manmohan Singh Chadha, San Jose, CA (US);
Vijay D. Parkhe, San Jose, CA (US);
Glen T Mori, Gilroy, CA (US);
Christopher Laurent Beaudry, San Jose, CA (US);
Assignee:
Applied Materials, Inc., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/68 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/68785 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 21/6833 (2013.01); H01L 21/68757 (2013.01);
Abstract
An electrostatic chuck assembly includes a first puck plate including one or more first functional elements, a second puck plate including one or more second functional elements, and an interface layer at least partially bonding the first puck plate and the second puck plate.