The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

May. 22, 2024
Applicant:

Lam Research Corporation, Fremont, CA (US);

Inventors:

Aaron Louis Labrie, Sherwood, OR (US);

Claudiu Valentin Puha, Aloha, OR (US);

Assignee:

Lam Research Corporation, Fremont, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6838 (2013.01); H01L 21/68 (2013.01); H01L 21/68728 (2013.01); H01L 21/68785 (2013.01); H01L 21/68792 (2013.01);
Abstract

Some examples provide a vacuum wafer chuck assembly for supporting a wafer. An example chuck assembly comprises a chuck hub and a centering hub disposed within the chuck hub. Chuck arms are mounted to the chuck hub, with each chuck arm extending radially between a proximal end adjacent the chuck hub, and a distal end remote therefrom. At least one vacuum pad is provided for supporting the wafer during a wafer centering or wafer processing operation. A vacuum sensor detects a presence or absence of a vacuum pressure at the vacuum pad during the wafer centering or processing operation, a detection indicative of a presence or absence of the wafer in the chuck assembly, or a presence of a defective wafer.


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