The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 23, 2025
Filed:
Aug. 07, 2023
Applicant:
Innolux Corporation, Miao-Li County, TW;
Inventors:
Chuan-Ming Yeh, Miao-Li County, TW;
Heng-Shen Yeh, Miao-Li County, TW;
Kuo-Jung Fan, Miao-Li County, TW;
Cheng-Chi Wang, Miao-Li County, TW;
Assignee:
Innolux Corporation, Miaoli County, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/562 (2013.01); H05K 1/0271 (2013.01); H05K 3/007 (2013.01); H05K 3/4647 (2013.01); H05K 2201/068 (2013.01);
Abstract
The embodiment of the disclosure provides a composite layer circuit element of an electronic device. The composite layer circuit element includes a first dielectric layer, a first circuit layer and a second dielectric layer. The first circuit layer is disposed on the first dielectric layer, and the second dielectric layer is disposed on the first circuit layer. A thickness of the first dielectric layer is greater than a thickness of the second dielectric layer in a cross section view.