The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Feb. 21, 2024
Applicant:

Stephen Andrew Steger, Los Angeles, CA (US);

Inventor:

Stephen Andrew Steger, Los Angeles, CA (US);

Assignee:

Snap Inc., Santa Monica, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02C 1/00 (2006.01); B29C 45/14 (2006.01); G02B 27/01 (2006.01); G02C 5/00 (2006.01); G02C 11/00 (2006.01); B29D 12/02 (2006.01); B29K 77/00 (2006.01); B29L 12/00 (2006.01);
U.S. Cl.
CPC ...
G02B 27/0176 (2013.01); B29C 45/14065 (2013.01); G02C 5/001 (2013.01); G02C 11/10 (2013.01); B29D 12/02 (2013.01); B29K 2023/06 (2013.01); B29K 2077/00 (2013.01); B29L 2012/005 (2013.01); G02B 2027/0178 (2013.01);
Abstract

An article includes a hollow enclosure defining a void. The void has a first section and a second section separate from the first section. An electronic component is housed in the first section and the second section of the void. A low pressure mold material is molded into the first section of the void and cured around a first segment of the electronic component to encapsulate the first segment of the electronic component. A support seal is inserted into the second section of the void adjacent a second segment of the electronic component. The support seal defines a sealing barrier on one side of the low pressure mold material that limits the flow of low pressure mold material out of the first section of the void.


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