The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Jun. 15, 2022
Applicant:

Lite-on Technology Corporation, Taipei, TW;

Inventors:

Cheng-Han Wang, New Taipei, TW;

Cheng-Hong Su, Taipei, TW;

Chih-Li Yu, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01L 25/16 (2023.01); H10F 77/40 (2025.01); H10F 77/50 (2025.01); H10H 20/852 (2025.01);
U.S. Cl.
CPC ...
G02B 6/12004 (2013.01); H01L 25/167 (2013.01); H10F 77/413 (2025.01); H10F 77/50 (2025.01); H10H 20/852 (2025.01);
Abstract

A package structure is provided. The package structure includes at least one optoelectronic device, a lead frame, and an encapsulant. The optoelectronic device is disposed on the lead frame. The lead frame includes at least one lead unit that includes a first lead and a second lead. The first lead has a first bonding part and a first pin. The first bonding part has a first inclined sidewall at an upper end of one side away from the second lead. The second lead has a second pin and a carrying part, of which an upper end has a die-attaching region for carrying the optoelectronic device. The encapsulant covers at least the optoelectronic device, the first bonding part, and the carrying part.


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