The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Oct. 28, 2022
Applicant:

Nanjing University of Aeronautics and Astronautics, Nanjing, CN;

Inventors:

Chao Zhang, Nanjing, CN;

Zhaomin Wang, Nanjing, CN;

Hongli Ji, Nanjing, CN;

Jinhao Qiu, Nanjing, CN;

Chongcong Tao, Nanjing, CN;

Jun Wang, Nanjing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/06 (2006.01); B33Y 40/00 (2020.01); B33Y 50/00 (2015.01); G01N 29/22 (2006.01); G01N 29/46 (2006.01);
U.S. Cl.
CPC ...
G01N 29/06 (2013.01); B33Y 40/00 (2014.12); B33Y 50/00 (2014.12); G01N 29/225 (2013.01); G01N 29/46 (2013.01); G01N 2291/0289 (2013.01);
Abstract

The present disclosure relates to a method and system for detecting a structural defect in additive manufacturing. The method includes: layering a three-dimensional model of an additive manufacturing test piece to obtain a two-dimensional contour of an interface of each layer, and generating a machining path; arranging a non-contact sensor at a fixed measuring point of the additive manufacturing test piece, and acquiring an ultrasonic signal at each machining point when a pulse laser conducts machining point by point along the machining path; forming a visual ultrasonic field based on all the ultrasonic signals, and determining ultrasonic field data; determining, based on the ultrasonic field data, a curve of a peak of an incident wave changing with the machining path; and determining whether a machining defect exists at the machining points based on the curve of the peak of the incident wave changing with the machining path.


Find Patent Forward Citations

Loading…