The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Jul. 07, 2022
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventor:

Hiroshi Fukuda, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/956 (2006.01); G06T 7/00 (2017.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01N 21/95607 (2013.01); G06T 7/001 (2013.01); H01L 22/12 (2013.01); G06T 2207/30148 (2013.01);
Abstract

An object is to provide a measurement system or the like that enables selection of appropriate new measurement targets by performing measurement on a limited number of measurement points. Proposed is a system including a measurement tool; and a computer system configured to communicate with the measurement tool, in which the computer system is configured to calculate, based on feature data of a plurality of locations on a wafer received from the measurement tool, an in-plane distribution of the feature data on the wafer (C), select, based on the calculated in-plane distribution, a new measurement point for acquiring the feature data (D), calculate, based on feature data acquired by measuring the selected new measurement point (B), a new in-plane distribution of the feature data on the wafer (F), and output at least one of the feature data of the new measurement point and the in-plane distribution which are acquired by executing the selection of the new measurement point and the calculation of the new in-plane distribution at least once (H).


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