The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Jun. 02, 2020
Applicant:

Hitachi High-tech Corporation, Tokyo, JP;

Inventors:

Toshifumi Honda, Tokyo, JP;

Takanori Kondo, Tokyo, JP;

Nobuhiro Obara, Tokyo, JP;

Masami Makuuchi, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); G01N 21/47 (2006.01); G01N 21/88 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/47 (2013.01); G01N 21/88 (2013.01); G01N 2021/4711 (2013.01); G01N 2201/02 (2013.01);
Abstract

Provided is a defect inspection apparatus including a plurality of detection optical systems for collecting illumination scattered light from the surface of a sample, a plurality of sensors for converting the illumination scattered light collected by the corresponding detection optical systems into electrical signals and outputting detection signals, and a signal processing device for processing the detection signals input from the plurality of sensors, wherein the signal processing device generates a first signal group including an integrated signal obtained by adding a plurality of detection signals in a predetermined combination based on a group of detection signals input from the plurality of sensors, generates a second signal group by performing the filtering processing on each signal that configures the first signal group, generates a third signal group including separated signals separated according to a predetermined rule from the signal corresponding to the integrated signal based on the second signal group, and detects or classifies defects based on the third signal group to store defect inspection data in a memory.


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