The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Dec. 10, 2024
Applicant:

Auo Corporation, Hsinchu, TW;

Inventors:

Yin-Ting Lee, Hsinchu, TW;

Hui-Chuan Chen, Hsinchu, TW;

Bo-Yuan Su, Hsinchu, TW;

Pei-Chia Wu, Hsinchu, TW;

Assignee:

AUO CORPORATION, Hsinchu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/13357 (2006.01); F21V 19/00 (2006.01);
U.S. Cl.
CPC ...
F21V 19/0025 (2013.01); G02F 1/133603 (2013.01);
Abstract

A backlight module includes a back plate, a conductive colloid disposed on a surface of the back plate, and a lighting board. The back plate includes a positioning portion. The lighting board includes a substrate and a plurality of light-emitting components. A first surface of the substrate is divided into a light-emitting region adjacent to a first side of the substrate and a peripheral region adjacent to a second side of the substrate. The peripheral region includes a slot penetrating through the first surface and a second surface of the substrate and extending to the second side. The substrate is sleeved on and positioned to the positioning portion by the slot. The positioning portion abuts against the peripheral region. The substrate faces toward the back plate and is adhered to the conductive colloid by the second surface. A position of the conductive colloid corresponds to the light-emitting region.


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