The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Nov. 27, 2019
Applicant:

Zeon Corporation, Tokyo, JP;

Inventors:

Kentaro Hayasaka, Tokyo, JP;

Kunihiko Makino, Tokyo, JP;

Tomoya Taniyama, Tokyo, JP;

Assignee:

ZEON CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 9/04 (2006.01); C08K 3/06 (2006.01); B29C 41/14 (2006.01); C08L 27/06 (2006.01);
U.S. Cl.
CPC ...
C08L 9/04 (2013.01); C08K 3/06 (2013.01); B29C 41/14 (2013.01); C08L 27/06 (2013.01); C08L 2312/00 (2013.01);
Abstract

A latex composition for dip-molding obtained by mixing a latex of conjugated diene polymer (A) having a glass transition temperature of 10° C. or less and a latex of polymer (B) having a glass transition temperature above 10° C. A latex composition for dip-molding capable of providing a dip-molded article excellent in wear resistance, as well as wet grip when water and oil are deposited thereon can be provided.


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