The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Oct. 01, 2021
Applicant:

Jsp Corporation, Chiyoda-ku, JP;

Inventors:

Hirotoshi Kakuta, Tochigi, JP;

Mikidai Fujita, Tochigi, JP;

Naoya Katsuyama, Tochigi, JP;

Assignee:

JSP CORPORATION, Chiyoda-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/06 (2006.01); B32B 5/18 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 37/15 (2006.01);
U.S. Cl.
CPC ...
B32B 27/065 (2013.01); B32B 5/18 (2013.01); B32B 27/30 (2013.01); B32B 27/32 (2013.01); B32B 37/153 (2013.01); B32B 2250/02 (2013.01); B32B 2264/108 (2013.01); B32B 2266/025 (2013.01); B32B 2305/022 (2013.01); B32B 2307/202 (2013.01); B32B 2307/7376 (2023.05); B32B 2323/046 (2013.01); B32B 2331/04 (2013.01); B32B 2333/12 (2013.01); B32B 2439/00 (2013.01);
Abstract

A polyethylene-based resin multilayer foam sheet may include a polyethylene-based resin foam layer containing a polyethylene-based resin (A) as a base resin, and a conductive layer laminated on at least one side of the foam layer. The conductive layer contains: a mixed resin of one or more polyethylenes (B) of low-density polyethylenes and/or linear low-density polyethylenes and an ethylene-based copolymer (C) having a structural unit derived from ethylene and a structural unit derived from a monomer having a polar group; and conductive carbon. The conductive carbon blended in the conductive layer may be in a range of from 3 to 15 wt. %. The difference, Tm−Tm, between the melting point Tmof the polyethylene (B) and the melting point Tmof the ethylene-based copolymer (C) each contained in the conductive layer may be in a range of from 30 to 80° C.


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