The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Oct. 09, 2020
Applicant:

Schunk Kohlenstofftechnik Gmbh, Heuchelheim, DE;

Inventors:

Günter Rinn, Lahnau, DE;

Hauke Voormann, Linden, DE;

Sören Baumann, Gießen, DE;

Mesut Altuntas, Frankfurt, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 43/14 (2006.01); B29C 43/34 (2006.01); B29C 43/36 (2006.01); B29C 43/52 (2006.01); B29K 101/10 (2006.01); B29K 105/16 (2006.01);
U.S. Cl.
CPC ...
B29C 43/14 (2013.01); B29C 43/34 (2013.01); B29C 43/361 (2013.01); B29C 43/52 (2013.01); B29C 2043/143 (2013.01); B29C 2043/3634 (2013.01); B29K 2101/10 (2013.01); B29K 2105/16 (2013.01);
Abstract

A process for producing a molded part from a highly filled thermosetting starting material including: introducing the starting material into a prepressing tool; producing a preform from the starting material, the starting material being brought to a prepressing temperature by the prepressing tool and being compressed with a prepressing force to form the preform; removing the preform from the prepressing tool and introducing the preform into a finish pressing tool; and producing a finished part from the preform, the preform being brought to a finish pressing temperature by the finish pressing tool and being compressed with a finish pressing force to form the finished part. Here, the prepressing temperature is lower than the finish pressing temperature and the finish pressing temperature is at least as high as an onset temperature of a curing reaction of the starting material.


Find Patent Forward Citations

Loading…