The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Oct. 30, 2023
Applicant:

Thync Global, Inc., Los Gatos, CA (US);

Inventors:

Wing Law, Cupertino, CA (US);

Isy Goldwasser, Los Gatos, CA (US);

Remi Demers, Saint-Nicolas, CA;

Sumon K. Pal, Boston, MA (US);

Assignee:

Thync Global, Inc., Los Gatos, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/36 (2006.01); A61N 1/04 (2006.01);
U.S. Cl.
CPC ...
A61N 1/36034 (2017.08); A61N 1/0456 (2013.01); A61N 1/0496 (2013.01);
Abstract

Wearable neuromodulator devices. The devices may include a first electrode and a second electrode on a flexible substrate. A first hydrogel layer may be in electrical communication with the first electrode and a second hydrogel layer may be in electrical communication with the second electrode. A third hydrogel layer may be in electrical communication with the first hydrogel layer. The first hydrogel layer may be separated from the third hydrogel layer by a removable release layer. A circuit interrupt may be removably coupled with control circuitry. The circuit interrupt may be interposed between a battery and the control circuitry so that removing the circuit interrupt powers the control circuitry. The control circuitry may be configured to deliver a first predefined waveform between the first and second electrodes after the circuit interrupt is removed, and a second predefined waveform between the first and second electrodes after the release layer is removed.


Find Patent Forward Citations

Loading…