The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 23, 2025

Filed:

Jul. 28, 2022
Applicant:

Shenzhen Mindray Bio-medical Electronics Co., Ltd., Shenzhen, CN;

Inventors:

Shenhui Dong, Shenzhen, CN;

Xuegang Zhang, Shenzhen, CN;

Chao Zhu, Shenzhen, CN;

Jian Cen, Shenzhen, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); A61B 5/00 (2006.01); A61B 5/021 (2006.01); H05K 5/00 (2025.01); H05K 5/15 (2025.01); H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
A61B 5/00 (2013.01); A61B 5/021 (2013.01); A61B 5/02141 (2013.01); A61B 5/742 (2013.01); H05K 5/15 (2025.01); A61B 2560/0406 (2013.01); A61B 2560/0443 (2013.01);
Abstract

A medical device, comprising a housing, a combined modular structure which is formed by connecting a board card and an interface panel to a main bracket; a first opening arranged on the housing for the insertion of the combined modular structure; a first locking structure for locking and fixing the combined modular structure to the housing; a screen assembly; a second opening arranged on the housing for mounting the screen assembly, and a second locking structure for locking and fixing the screen assembly to the housing. The integral arrangement of a functional module of a medical device helps to improve the assembly precision between various components, and ensure the reliability of the connection between components. The housing adopts an integral structure, has good waterproof and dustproof effects as well as low production costs; the present disclosure facilitates the assembly of board card and other components, as well as module configuration and modular testing while also having good seismic performance.


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