The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Mar. 06, 2023
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Koji Kitahara, Ina, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 21/306 (2006.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/182 (2013.01); H01L 21/30604 (2013.01); H01L 21/76831 (2013.01); H01L 23/481 (2013.01); H05K 3/0017 (2013.01); H05K 3/107 (2013.01); H01L 24/16 (2013.01); H01L 2224/161 (2013.01); H01L 2924/181 (2013.01); H05K 2201/10068 (2013.01);
Abstract

A circuit board includes a semiconductor substrate having a first surface and a second surface located on an opposite side from the first surface, a through hole penetrating the first surface and the second surface, an organic insulating film disposed on the first surface and a side surface of the through hole, and a conductor disposed on an opposite side of the organic insulating film from a side surface side of the through hole. The side surface of the through hole has a first side surface coupled to the first surface and having a width decreased from the first surface toward the second surface, and a second side surface coupled to the second surface from an end portion of the first side surface on a second surface side.


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