The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Mar. 03, 2021
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Chao Yang, Shanghai, CN;

Christopher B. Walker, Jr., St. Paul, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 31/00 (2006.01); B32B 25/04 (2006.01); B32B 27/36 (2006.01); C08J 3/24 (2006.01); C08J 3/28 (2006.01); H04R 7/02 (2006.01);
U.S. Cl.
CPC ...
H04R 31/003 (2013.01); C08J 3/247 (2013.01); C08J 3/28 (2013.01); H04R 7/02 (2013.01); B32B 25/042 (2013.01); B32B 27/36 (2013.01); B32B 2274/00 (2013.01); B32B 2307/10 (2013.01); B32B 2307/102 (2013.01); B32B 2307/54 (2013.01); B32B 2307/7376 (2023.05); B32B 2310/08 (2013.01); B32B 2310/0875 (2013.01); B32B 2310/0887 (2013.01); B32B 2367/00 (2013.01); H04R 2307/025 (2013.01);
Abstract

The invention provides a diaphragm for a microspeaker and a manufacturing method thereof. The diaphragm is a single-layer diaphragm or a multi-layer diaphragm and comprises at least one layer of a chemically cross-linked thermoplastic polyester elastomer, wherein: the chemically cross-linked thermoplastic polyester elastomer has a loss factor less than or equal to 0.4 at a temperature range not higher than a softening temperature of thermoplastic polyester elastomer before chemical crosslinking plus 40° C., as measured by a rheological curve; and the diaphragm further has a yield strain in the range of 7% to 30%. The diaphragm for a microspeaker according to the technical solution of the present invention is easy to be prepared by thermoforming, and has appropriate modulus, good strength, elasticity, and thermal stability.


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