The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Nov. 06, 2023
Applicant:

Marvell Asia Pte Ltd, Singapore, SG;

Inventor:

Radhakrishnan L. Nagarajan, Santa Clara, CA (US);

Assignee:

MARVELL ASIA PTE LTD, Singapore, SG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); G02B 6/12 (2006.01); G02B 6/126 (2006.01); H01S 3/13 (2006.01); H01S 5/00 (2006.01); H01S 5/0234 (2021.01); H01S 5/02375 (2021.01); H04B 10/40 (2013.01); H04J 14/02 (2006.01); G02B 6/122 (2006.01); H01S 5/0687 (2006.01); H04B 10/29 (2013.01); H04B 10/291 (2013.01); H04B 10/50 (2013.01); H04B 10/564 (2013.01); H04J 14/06 (2006.01);
U.S. Cl.
CPC ...
H04B 10/40 (2013.01); G02B 6/12004 (2013.01); G02B 6/126 (2013.01); G02B 6/4226 (2013.01); G02B 6/4246 (2013.01); G02B 6/428 (2013.01); H01S 3/13 (2013.01); H01S 5/0085 (2013.01); H01S 5/0234 (2021.01); H01S 5/02375 (2021.01); H04J 14/02 (2013.01); G02B 2006/12061 (2013.01); G02B 2006/12097 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12123 (2013.01); G02B 2006/12142 (2013.01); G02B 6/1228 (2013.01); H01S 5/0687 (2013.01); H04B 10/29 (2013.01); H04B 10/2914 (2013.01); H04B 10/50 (2013.01); H04B 10/564 (2013.01); H04J 14/06 (2013.01);
Abstract

An integrated circuit includes a silicon photonics substrate and includes a transimpedance amplifier (TIA) chip and a driver chip arranged on the silicon photonics substrate. The silicon photonics substrate includes a silicon-based material, includes electrical connections, and includes silicon photonics components configured to receive and transmit optical signals. The TIA chip includes a silicon-germanium material that is different from the silicon-based material, is connected via the electrical connections to at least one of the silicon photonics components configured to receive an optical signal, and is configured to process a received optical signal and to output a processed signal to a digital signal processor. The driver chip includes CMOS material that is different from the silicon-germanium material and the silicon-based material, and is connected via the electrical connections to drive at least one of the silicon photonics components configured to generate an optical signal for transmission.


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