The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 16, 2025
Filed:
Jul. 20, 2021
Thales Alenia Space Italia S.p.a Con Unico Socio, Rome, IT;
Paolo Ranieri, Rome, IT;
Antonio Salvato, Rome, IT;
Elio Picchione, Rome, IT;
Andrea Cafaggi, Rome, IT;
Abstract
A capacitive feedthrough hermetically sealable to a hybrid module for space applications is provided that includes a multilayer ceramic structure including, on the top face, a metallized top central region designed to receive an input electrical signal to be filtered, a dielectric top region extending around the metallized top central region, and a metallized top peripheral region extending around the dielectric top region up to joining the metallized external closed side walls to act therewith as electrical ground; and, on the bottom face, a metallized bottom central region designed to provide an output filtered electrical signal, a dielectric bottom region extending around the metallized bottom central region, and a metallized bottom peripheral region extending around the dielectric bottom region up to joining the metallized external closed side walls to act therewith as electrical ground. The multilayer ceramic structure further includes ceramic layers, first metallized layers and one or more second metallized layers stacked on one another such that: each first metallized layer is interposed between two respective ceramic layers arranged immediately on and below said first metallized layer; each/the second metallized layer is interposed between two respective ceramic layers arranged immediately on and below said second metallized layer; the first and second metallized layers are vertically alternated such that each/the second metallized layer has a respective upper first metallized layer arranged above said second metallized layer, and a respective lower first metallized layer arranged below said second metallized layer; and two ceramic layers are respectively arranged immediately below the top face and immediately above the bottom face.