The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Jan. 29, 2021
Applicant:

Dexerials Corporation, Shimotsuke, JP;

Inventors:

Ryo Ito, Tochigi, JP;

Yasunobu Yamada, Tochigi, JP;

Daisuke Sato, Tochigi, JP;

Assignee:

DEXERIALS CORPORATION, Shimotsuke, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/02 (2006.01); H01R 12/57 (2011.01);
U.S. Cl.
CPC ...
H01R 43/0256 (2013.01); H01R 12/57 (2013.01);
Abstract

A method for manufacturing a connection body capable of suppressing deformation of a connector having a terminal array with a narrow pitch and obtaining excellent insulation and conductivity, and the connection body. The method includes: a step of fixing, on a first terminal array of a substrate, via a thermosetting connection material containing solder particles, a connector having a second terminal array having a minimum inter-terminal distance of 0.8 mm or less in the first terminal array and the second terminal array inside a bonding surface to be bonded with the substrate, and a step of joining the first terminal array and the second terminal array without a load by using a reflow furnace set to a temperature equal to or higher than the melting point of the solder particles.


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