The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Sep. 14, 2020
Applicant:

Viasat, Inc., Carlsbad, CA (US);

Inventors:

Luis G. Astorga, Chandler, AZ (US);

Steven J. Franson, Scottsdale, AZ (US);

Assignee:

VIASAT, INC., Carlsbad, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/00 (2006.01); H01Q 1/48 (2006.01); H01Q 3/36 (2006.01); H01R 12/52 (2011.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01Q 1/48 (2013.01); H01Q 3/36 (2013.01); H01R 12/52 (2013.01); H05K 1/144 (2013.01); H05K 1/181 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H05K 2201/10242 (2013.01); H05K 2201/10265 (2013.01);
Abstract

An antenna apparatus includes an antenna substrate with opposite first and second surfaces; and a PCB having opposite first and second surfaces. Antenna elements are disposed at the first surface of the antenna substrate. Electrically conductive columns, each having a first end attached to the second surface of the PCB and a second end attached to the second surface of the antenna substrate, secure the PCB to the antenna substrate and provide an electrical interconnect between the PCB and the antenna substrate. RFIC chips are each attached to the second surface of the antenna substrate and are coupled to the antenna elements. At least one circuit element is attached to the first surface of the PCB and electrically coupled to at least one of the RFIC chips through at least one of the electrically conductive columns.


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