The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Mar. 30, 2023
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Keiichi Ichikawa, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H05K 1/14 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 9/0407 (2013.01); H05K 1/144 (2013.01); H01L 24/16 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10098 (2013.01);
Abstract

A first board body includes a first board body upper main surface and a first board body lower main surface that are arranged in a vertical direction. A second board body includes a second board body upper main surface and a second board body lower main surface that are arranged in the vertical direction. The second board body is above the first board body such that the first board body upper main surface and the second board body lower main surface face each other. A semiconductor element is mounted on the first board body lower main surface. An antenna is provided on the second board body. A thickness of a metal plate is larger than a thickness of a first conductor pattern. The metal plate is surface-joined to the first board body upper main surface to overlap the semiconductor element.


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