The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2025

Filed:

Apr. 05, 2024
Applicants:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Ati Technologies Ulc, Markham, CA;

Inventors:

Suming Hu, Santa Clara, CA (US);

Farshad Ghahghahi, Santa Clara, CA (US);

Assignees:

ADVANCED MICRO DEVICES, INC., Santa Clara, CA (US);

ATI TECHNOLOGIES ULC, Markham, CA;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/13 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 2224/11622 (2013.01); H01L 2224/13006 (2013.01); H01L 2224/13018 (2013.01); H01L 2224/13541 (2013.01); H01L 2224/13552 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01);
Abstract

In an implementation, a semiconductor chip includes a device layer, an interconnect layer fabricated on the device layer, the interconnect layer including a conductive pad, and a conductive pillar coupled to the conductive pad. The conductive pillar includes at least a first portion having a first width and a second portion having a second width, the first portion being disposed between the second portion and the conductive pad, wherein the first width of the first portion is greater than the second width of the second portion.


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