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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12417951 B1

PDFFull Text
Date of Patent:
Sep. 16, 2025

Filed:

Jul. 14, 2020

Semiconductor device and power conversion device

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Wakana Noboru, Tokyo, JP;

Hodaka Rokubuichi, Tokyo, JP;

Kei Yamamoto, Tokyo, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

XSENSUS LLP

Primary Examiner:

Peniel M Gumedzoe

Int. Cl.
CPC ...
H01L 23/053 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01); H02M 7/00 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/053 (2013.01); H01L 23/3735 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H02M 7/003 (2013.01); H05K 1/144 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15787 (2013.01);
Abstract

A highly reliable semiconductor device and power conversion device are obtained. In the semiconductor device, a semiconductor element is mounted on a main surface of a base member. A case includes a side wall surrounding the base member. A support portion is formed on an inner peripheral surface of the side wall on a side of the base member. At least a part of the support portion is in contact with a contact region located inside an outer peripheral end of wiring board on a surface of the wiring board located on the side of the semiconductor element. A sealing member seals the semiconductor element and the wiring board. A terminal member is connected to a region of the wiring board closer to the outer peripheral end than the contact region. The terminal member includes an end portion protruding from a surface of the sealing member.

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